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Fei Wang
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Journal Articles
System in package (SiP) technology: fundamentals, design and applications
Available to PurchaseFabio Santagata, Jianwen Sun, Elina Iervolino, Hongyu Yu, Fei Wang, Guoqi Zhang, P.M. Sarro, Guoyi Zhang
Journal:
Microelectronics International
Microelectronics International (2018) 35 (4): 231–243.
Published: 01 October 2018
