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Journal Articles

Overview and outlook of through‐silicon via (TSV) and 3D integrations

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John H. Lau
Journal: Microelectronics International
Microelectronics International (2011) 28 (2): 8–22.
https://doi.org/10.1108/13565361111127304
Published: 10 May 2011
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Journal Articles

Thermal performance of a low‐cost thermal enhanced plastic ball grid array package ‐ NuBGA

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John H. Lau, K.L. Chen, F. Wu
Journal: Microelectronics International
Microelectronics International (1998) 15 (2): 25–33.
https://doi.org/10.1108/13565369810215609
Published: 01 August 1998
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