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Journal Articles

3D LED and IC wafer level packaging

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John Lau, Ricky Lee, Matthew Yuen, Philip Chan
Journal: Microelectronics International
Microelectronics International (2010) 27 (2): 98–105.
https://doi.org/10.1108/13565361011034786
Published: 11 May 2010
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Journal Articles

Effect of heat‐spreader sizes on the thermal performance of large cavity‐down plastic ball grid array packages ‐ NuCSP

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John Lau, Tony Chen
Journal: Microelectronics International
Microelectronics International (1999) 16 (2): 24–33.
https://doi.org/10.1108/13565369910268240
Published: 01 August 1999
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