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Journal Articles

A study of aluminium wire failure in automotive under‐hood applications

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Sung Yi, Sang Kyoo Park, Kiat Choon Teo
Journal: Microelectronics International
Microelectronics International (2006) 23 (2): 11–20.
https://doi.org/10.1108/13565360610659653
Published: 01 May 2006
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Journal Articles

Reliability assessment for SnPb solder and Ag‐Pd bond pad metallization

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Kiat Choon Teo, Yu Lin Ting
Journal: Microelectronics International
Microelectronics International (2005) 22 (2): 21–27.
https://doi.org/10.1108/13565360510592199
Published: 01 August 2005
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