Skip to Main Content
Mingzhi Dong
Close
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Journal Articles

3D system-in-package design using stacked silicon submount technology

Available to Purchase
Mingzhi Dong, Fabio Santagata, Robert Sokolovskij, Jia Wei, Cadmus Yuan, Guoqi Zhang
Journal: Microelectronics International
Microelectronics International (2015) 32 (2): 63–72.
https://doi.org/10.1108/MI-11-2014-0050
Published: 05 May 2015
View article titled, 3D system-in-package design using stacked silicon submount technology
Open the PDF for 3D system-in-package design using stacked silicon submount technology in another window
Add to Citation Manager for 3D system-in-package design using stacked silicon submount technology
This Feature Is Available To Subscribers Only

or Create an Account

Close Modal
Close Modal