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Muhammad Nubli Zulkifli
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Journal Articles

Effect of surface roughness and hardness of leadframe on the bondability of gold wedge bonds

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Muhammad Nubli Zulkifli, Fuaida Harun, Azman Jalar
Journal: Microelectronics International
Microelectronics International (2019) 36 (2): 62–67.
https://doi.org/10.1108/MI-08-2018-0053
Published: 15 February 2019
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Journal Articles

Temperature cycling analysis for ball grid array package using finite element analysis

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Muhammad Nubli Zulkifli, Zul Azhar Zahid Jamal, Ghulam Abdul Quadir
Journal: Microelectronics International
Microelectronics International (2011) 28 (1): 17–28.
https://doi.org/10.1108/13565361111097083
Published: 25 January 2011
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