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Journal Articles

Comparative analysis of gold-coated silver and conventional gold wire for semiconductor wire bonding: material properties and corrosion susceptibility in microelectronics

Muralidharan Sundararajan, Mutharasu Devarajan, Ahmad Zarif Azahar, Derek Mong

Microelectronics International (2026) 43 (1): 27–35.

https://doi.org/10.1108/MI-04-2025-0053

Published: 01 January 2026

View article titled, Comparative analysis of gold-coated silver and conventional gold wire for semiconductor wire bonding: material properties and corrosion susceptibility in microelectronics

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Journal Articles

Influence of extended surface area of heatsink on heat transfer: design and analysis

Shanmugan Subramani, Mutharasu Devarajan

Microelectronics International (2024) 41 (2): 66–74.

https://doi.org/10.1108/MI-09-2022-0171

Published: 16 February 2023

View article titled, Influence of extended surface area of heatsink on heat transfer: design and analysis

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Journal Articles

CVD processed ZnO thin film as solid thermal interface material in electronic devices: thermal and optical performance of LED

Shanmugan Subramani, Mutharasu Devarajan

Microelectronics International (2024) 41 (2): 57–65.

https://doi.org/10.1108/MI-05-2022-0080

Published: 02 February 2023

View article titled, CVD processed ZnO thin film as solid thermal interface material in electronic devices: thermal and optical performance of LED

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Journal Articles

Enhancement of luminous flux of InGaAlP-based low-power SMD LEDs using substrates with different thermal resistances

Muna Ezzi Raypah, Shahrom Mahmud, Mutharasu Devarajan, Anoud AlShammari

Microelectronics International (2021) 38 (1): 6–13.

https://doi.org/10.1108/MI-06-2020-0035

Published: 28 December 2020

View article titled, Enhancement of luminous flux of InGaAlP-based low-power SMD LEDs using substrates with different thermal resistances

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Journal Articles

Influence of thermal interface material on thermal performance of InGaAlP thin-film SMD LED mounted on different substrate packages

Muna E. Raypah, Mutharasu Devarajan, Fauziah Sulaiman

Microelectronics International (2018) 35 (2): 104–114.

https://doi.org/10.1108/MI-05-2017-0027

Published: 03 April 2018

View article titled, Influence of thermal interface material on thermal performance of InGaAlP thin-film SMD LED mounted on different substrate packages

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Journal Articles

Performance of Cu-Al₂O₃ thin film as thermal interface material in LED package: thermal transient and optical output analysis

Wei Qiang Lim, Mutharasu Devarajan, Shanmugan Subramani

Microelectronics International (2018) 35 (1): 33–44.

https://doi.org/10.1108/MI-07-2016-0053

Published: 02 January 2018

View article titled, Performance of Cu-Al2O3 thin film as thermal interface material in LED package: thermal transient and optical output analysis

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Journal Articles

Variation of thermal resistance with input current and ambient temperature in low-power SMD LED

Muna E. Raypah, Dheepan M.K., Mutharasu Devarajan, Shanmugan Subramani, Fauziah Sulaiman

Microelectronics International (2018) 35 (1): 1–11.

https://doi.org/10.1108/MI-08-2016-0055

Published: 02 January 2018

View article titled, Variation of thermal resistance with input current and ambient temperature in low-power SMD LED

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Journal Articles

Effects of ball bond diameter on wire bond reliability for automotive application

Hui Yuen Peng, Mutharasu Devarajan, Teik Toon Lee, David Lacey

Microelectronics International (2016) 33 (1): 53–60.

https://doi.org/10.1108/MI-02-2015-0020

Published: 04 January 2016

View article titled, Effects of ball bond diameter on wire bond reliability for automotive application

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Journal Articles

Thermal resistance of high power LED influenced by ZnO thickness and surface roughness parameter

Shanmugan Subramani, Mutharasu Devarajan

Microelectronics International (2016) 33 (1): 15–22.

https://doi.org/10.1108/MI-10-2014-0045

Published: 04 January 2016

View article titled, Thermal resistance of high power LED influenced by ZnO thickness and surface roughness parameter

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Journal Articles

Thermal resistance studies of surface modified heat sink for 3W LED using transient curve

Shanmugan Subramani, Teeba Nadarajah, Mutharasu Devarajan

Microelectronics International (2013) 30 (2): 77–84.

https://doi.org/10.1108/13565361311314467

Published: 26 April 2013

View article titled, Thermal resistance studies of surface modified heat sink for 3W LED using transient curve

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Comparative analysis of gold-coated silver and conventional gold wire for semiconductor wire bonding: material properties and corrosion susceptibility in microelectronics

Influence of extended surface area of heatsink on heat transfer: design and analysis

CVD processed ZnO thin film as solid thermal interface material in electronic devices: thermal and optical performance of LED

Enhancement of luminous flux of InGaAlP-based low-power SMD LEDs using substrates with different thermal resistances

Influence of thermal interface material on thermal performance of InGaAlP thin-film SMD LED mounted on different substrate packages

Performance of Cu-Al₂O₃ thin film as thermal interface material in LED package: thermal transient and optical output analysis

Variation of thermal resistance with input current and ambient temperature in low-power SMD LED

Effects of ball bond diameter on wire bond reliability for automotive application

Thermal resistance of high power LED influenced by ZnO thickness and surface roughness parameter

Thermal resistance studies of surface modified heat sink for 3W LED using transient curve

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