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Ph. Philippov
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Journal Articles
Studying electro‐physical material characteristics of vacuum‐deposited layers of aluminium (tantalum) when using aluminium sheet as a carrier for MCM, interconnections, vias and resistive groups
Available to Purchase
Journal:
Microelectronics International
Microelectronics International (1998) 15 (3): 31–35.
Published: 01 December 1998
Journal Articles
A new concept for the use of Al‐sheet as integrated substrate for one or multichip module package
Available to Purchase
Journal:
Microelectronics International
Microelectronics International (1998) 15 (3): 36–41.
Published: 01 December 1998
