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Journal Articles

BGA substrate outgassing negative impact study on Cu wire bonding

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Hanmin Zhang, Ming Hu, Zhijie Wang, Qingchun He, Denghong Ye
Journal: Microelectronics International
Microelectronics International (2017) 34 (2): 84–90.
https://doi.org/10.1108/MI-03-2016-0030
Published: 02 May 2017
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Journal Articles

Wafer damage issue study by heavy Al wire wedge bonding

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Hanmin Zhang, Ming Hu, Fei Zong, Baoguan Yin, Denghong Ye, Qingchun He, Zhijie Wang
Journal: Microelectronics International
Microelectronics International (2014) 31 (2): 129–136.
https://doi.org/10.1108/MI-10-2013-0048
Published: 29 April 2014
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