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Journal Articles

Reliability of wirebonds in micro‐electronic packages

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W.D. van Driel, R.B.R. van Silfhout, G.Q. Zhang
Journal: Microelectronics International
Microelectronics International (2008) 25 (2): 15–22.
https://doi.org/10.1108/13565360810875967
Published: 18 April 2008
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