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Journal Articles

Evaluation of fan-out wafer level package strength

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Cheng Xu, Z.W. Zhong, W.K. Choi
Journal: Microelectronics International
Microelectronics International (2019) 36 (2): 54–61.
https://doi.org/10.1108/MI-06-2018-0040
Published: 01 March 2019
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Journal Articles

Fine and ultra‐fine pitch wire bonding: challenges and solutions

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Z.W. Zhong
Journal: Microelectronics International
Microelectronics International (2009) 26 (2): 10–18.
https://doi.org/10.1108/13565360910960187
Published: 08 May 2009
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Journal Articles

Wire bonding using copper wire

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Z.W. Zhong
Journal: Microelectronics International
Microelectronics International (2009) 26 (1): 10–16.
https://doi.org/10.1108/13565360910923115
Published: 23 January 2009
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Journal Articles

Wire bonding of low‐k devices

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Z.W. Zhong
Journal: Microelectronics International
Microelectronics International (2008) 25 (3): 19–25.
https://doi.org/10.1108/13565360810889584
Published: 25 July 2008
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Journal Articles

Wire bonding using insulated wire and new challenges in wire bonding

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Z.W. Zhong
Journal: Microelectronics International
Microelectronics International (2008) 25 (2): 9–14.
https://doi.org/10.1108/13565360810875958
Published: 18 April 2008
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Journal Articles

Recent advances in wire bonding, flip chip and lead‐free solder for advanced microelectronics packaging

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Z.W. Zhong, T.Y. Tee, J‐E. Luan
Journal: Microelectronics International
Microelectronics International (2007) 24 (3): 18–26.
https://doi.org/10.1108/13565360710779154
Published: 31 July 2007
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Journal Articles

Thermal strain analysis of IC packages using various Moiré methods

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Z.W. Zhong
Journal: Microelectronics International
Microelectronics International (2004) 21 (3): 25–28.
https://doi.org/10.1108/13565360410549693
Published: 01 December 2004
View article titled, Thermal strain analysis of IC packages using various Moiré methods
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Journal Articles

Inspection of electronics packages using the efficient perception technique

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Z.W. Zhong, Y. Jiang
Journal: Microelectronics International
Microelectronics International (2004) 21 (2): 41–44.
https://doi.org/10.1108/13565360410532015
Published: 01 August 2004
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Journal Articles

Characterization of low‐k benzocyclobutene dielectric thin film

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K.C. Chan, M. Teo, Z.W. Zhong
Journal: Microelectronics International
Microelectronics International (2003) 20 (3): 11–22.
https://doi.org/10.1108/13565360310487909
Published: 01 December 2003
View article titled, Characterization of low‐k benzocyclobutene dielectric thin film
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