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Keywords: 3D packaging
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Journal Articles
Journal:
Microelectronics International
Microelectronics International (2023) 40 (2): 109–114.
Published: 22 September 2022
...Youxin Zhang; Yang Liu; Rongxing Cao; Xianghua Zeng; Yuxiong Xue Purpose Concerning the radiation effects on the three-dimensional (3D) packaging in space environment, this study aims to investigate the influence of the total dose effect on the transmission characteristics of high-frequency...
