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Keywords: Adhesive force
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Journal Articles
Journal:
Microelectronics International
Microelectronics International (2020) 37 (1): 54–63.
Published: 21 January 2020
...M.H.H. Ishak; Farzad Ismail; Mohd Sharizal Abdul Aziz; M.Z. Abdullah Purpose The purpose of this study is to investigate the effect of the adhesive force and density ratio using lattice Boltzmann method (LBM) during underfill process. Design/methodology/approach To deal with complex flow...
