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Keywords: Advance packaging
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Journal Articles
Journal:
Microelectronics International
Microelectronics International (2023) 40 (1): 26–34.
Published: 15 July 2022
... Licensed re-use rights only Thermal resistance VCSEL Heat dissipation Advance packaging The ability to create or provide circular-symmetric and directed beams that are simpler to gather and focus on is a key characteristic of vertical-cavity surface-emitting laser (VCSEL), enabling...
