... © MCB UP Limited 2002 --> Amkor Technology Wire bonding Kulicke & Soffa and Amkor Technology announce Letter Of Intent for 200 wire bonders Keywords: Amkor Technology, Wire bonding Kulicke & Soffa Industries Inc. and Amkor Technology announced that Amkor...

... © MCB UP Limited 2000 --> Amkor Technology Integra Technologies Mergers and acquisitions Amkor expands IC test development capabilities; will acquire Integra Technologies Keywords Amkor Technology, Integra Technologies, Mergers and acquisitions In a move...

... machine, K&S wire bonders, a FICO transfer mold system, a K&S 7500 saw-singulation system, and a Lumonics laser-mark system. For flip-chip assembly, the SiP prototype lab is adjacent to Amkor's Datacon flip-chip pilot line. Amkor Technology System-in-package prototype line opens...

... © MCB UP Limited 2000 --> Amkor Technology RangeStar Wireless Antennas Amkor and RangeStar form partnership to place advanced antennas into module packages for wireless products Keywords Amkor Technology, RangeStar Wireless, Antennas Amkor Technology...

... technology and wireless applications. This expansion, along with the investments we have made in the development of advanced packaging technologies, puts us in a strong position to meet these demands". © MCB UP Limited 2000 --> Amkor Technology Growth Amkor technology announces...

... will generate significantly more EBITDA, which will facilitate the repayment of debt incurred in this transaction". Amkor completes acquisition of three semiconductor assembly factories Keywords Amkor Technology, Anam semiconductor, Semiconductors, Mergers and acquisitions Amkor Technology...

... © MCB UP Limited 2000 --> Amkor Technology Chip scale packaging AMKOR expands stacked chip-scale package capacity and 3D packaging family Keywords Amkor Technology, Chip scale packaging Amkor Technology has expanded its Stacked Chip Scale Package (S-CSP...

... © MCB UP Limited 2000 --> Kulicke & Soffa Amkor Technology Flip chip Electronics industry Keywords Kulicke & Soffa, Amkor Technology, Flip chip, Electronics industry Kulicke & Soffa Industries, Inc. and Amkor Technology, Inc. have announced a ten-year...

... attach, wafer scale package, and integrated passive device. These new and exciting applications are already demonstrating huge demand, especially with our wireless customers." © MCB UP Limited 2000 --> Amkor Technology Bumping Flip chip Packaging Keywords Amkor Technology...

... © MCB UP Limited 2000 --> Amkor Technology Unitive Licensing Flip chip Keywords Amkor Technology, Unitive, Licensing, Flip chip Amkor Technology, Inc. and Unitive Advanced Semiconductor Packaging have signed a ten-year technology transfer and licensing agreement...