... © MCB UP Limited 2002 --> Amkor Technology Wire bonding Kulicke & Soffa and Amkor Technology announce Letter Of Intent for 200 wire bonders Keywords: Amkor Technology, Wire bonding Kulicke & Soffa Industries Inc. and Amkor Technology announced that Amkor...

... © MCB UP Limited 2000 --> Amkor Technology Growth Amkor technology announces factory expansion plans for the Philippines and Korea Keywords Amkor Technology, Growth To keep pace with the explosive growth within the semiconductor industry,Amkor Technology, Inc...

... © MCB UP Limited 2000 --> Amkor Technology System-in-package prototype line opens at Amkor's Arizona facility Keyword Amkor Technology Intense customer interest in system-in-package (SiP) technology has led Amkor Technology to open an advanced SiP module...

... © MCB UP Limited 2000 --> Amkor Technology RangeStar Wireless Antennas Amkor and RangeStar form partnership to place advanced antennas into module packages for wireless products Keywords Amkor Technology, RangeStar Wireless, Antennas Amkor Technology...

... © MCB UP Limited 2000 --> Amkor Technology Chip scale packaging AMKOR expands stacked chip-scale package capacity and 3D packaging family Keywords Amkor Technology, Chip scale packaging Amkor Technology has expanded its Stacked Chip Scale Package (S-CSP...

... will generate significantly more EBITDA, which will facilitate the repayment of debt incurred in this transaction". © MCB UP Limited 2000 --> Amkor Technology Anam semiconductor Semiconductors Mergers and acquisitions Amkor completes acquisition of three semiconductor assembly...

... Amkor expands IC test development capabilities; will acquire Integra Technologies © MCB UP Limited 2000 --> Amkor Technology Integra Technologies Mergers and acquisitions Keywords Amkor Technology, Integra Technologies, Mergers and acquisitions In a move...

... and computing applications. Amkor Technology Unitive Licensing Flip chip Keywords Amkor Technology, Unitive, Licensing, Flip chip Amkor Technology, Inc. and Unitive Advanced Semiconductor Packaging have signed a ten-year technology transfer and licensing agreement that will add...

... © MCB UP Limited 2000 --> Amkor Technology Bumping Flip chip Packaging Keywords Amkor Technology, Bumping, Flip chip, Packaging Amkor Technology, Inc. has announced plans to add wafer bumping capabilities at its Korean manufacturing plant by the end of 2000...

... © MCB UP Limited 2000 --> Kulicke & Soffa Amkor Technology Flip chip Electronics industry Keywords Kulicke & Soffa, Amkor Technology, Flip chip, Electronics industry Kulicke & Soffa Industries, Inc. and Amkor Technology, Inc. have announced a ten-year...