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Keywords: Anisotropy
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Journal Articles
Journal:
Microelectronics International
Microelectronics International (1999) 16 (3): 6–14.
Published: 01 December 1999
...‐temperature high‐humidity tests. The reliability performance of the three processes (gold bumps with ACF, gold bumps with ACP, and eutectic solder bumps with underfill) is compared. © MCB UP Limited 1999 Flip chip Anisotropy Eutectic solder Underfill Reliability as shown in Figure 2...
