... hermetic packaging through Au–Si eutectic bonding. Design/methodology/approach Residual stress and thickness uniformity of room-temperature deposited Au film buffered by a thin Ti film were optimized concurrently by systematically adjusting deposition pressure, sputtering current and the spatial...

...Botao Liu; Yawei Wang; Junyuan Zhao; Xin Yang; Zeyu Wu; Bo Niu; Yiyi Hong; Weibin Cui; Yinfang Zhu; Lixin Cao Purpose This study aims to present a reliable wafer-level Au-Si eutectic bonding technique that achieves good hermeticity and high vacuum for MEMS resonators with extremely small cavities...