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Keywords: Bond integrity
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Journal Articles
Journal:
Microelectronics International
Microelectronics International (2013) 30 (3): 176–186.
Published: 26 July 2013
... to find the key process out of the manufacturing flow; a non‐destructive detaching method and cross section polishing were used to inspect the bond integrity; Auger analysis assisted with argon ion sputter was tried to confirm the contamination; finally the manufacturing processes were redesigned...
