... © MCB UP Limited 2000 --> CS2 EV Group Bumping Packaging CS2 and EV Group reveal bumping technology relationship Keywords CS2, EV Group, Bumping, Packaging EV Group (EVG), Austria and Custom Silicon Configuration Services (CS2),Belgium announced today that CS2...

... © MCB UP Limited 2000 --> Unitive Flip chip Bumping Keywords Unitive, Flip chip, Bumping Unitive Advanced Semiconductor Packaging announces the release to manufacturing of a low alpha count flip chip bumping process for both eutectic(63/37) and high-lead (95/5) solder...

... solder bumping capability will enhance Amkor's growing support for flip chip packages and complements our earlier joint-technology agreements with LSI Logic and Flip Chip Technology", said Richard Groover, Amkor vice president and chief technologist for flip chip technology. "Additionally, since...

...H. Richter; K. Ruess; A. Gemmler; W. Leonhard Bumping is a prerequisite for flip‐chip attachment of bare dies. For silicon semiconductors bumping is normally performed on the ICs at wafer scale. Bumping can be performed by micro‐plating or vacuum deposition techniques. Mechanical methods are also...

... semiconductor component level due to the limitations of wire bonds and lead frame fan‐outs. This paper suggests a new assembly method where low‐cost contact bumps are deposited on semiconductor wafers and then the dice are reflow soldered or gang bonded to the substrate. The bumps are electroless nickel...