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Keywords: CSP assembly
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Journal Articles
Dynamic reliability approach of chip scale package assembly under vibration environment
Available to Purchase
Journal:
Microelectronics International
Microelectronics International (2014) 31 (2): 71–77.
Published: 29 April 2014
...Ping Yang; Xiusheng Tang; Yu Liu; Shuting Wang; Jianming Yang Purpose – The purpose of this paper is to perform experimental tests on fatigue characteristics of chip scale package (CSP) assembly under vibration. Some suggestions for design to prolong fatigue life of CSP assembly are provided...
