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Keywords: CTE mismatch
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Journal Articles
Journal:
Microelectronics International
Microelectronics International (2020) 37 (4): 181–188.
Published: 03 August 2020
... Limited 2020 Emerald Publishing Limited Licensed re-use rights only Finite element analysis 2.5D interposers CTE mismatch Interfacial delamination Thermo-mechanical stresses Through-glass vias Energy release rate In 2.5 D integrated circuits (IC) technology, active dies are placed...
