... engineering Packaging materials Integrated circuits Fracture Composite materials Thermal expansion With component size reduction and computing capability increase, 30 percent of current chip performance is limited by electronic packaging materials (Lee et al., 2003). Thus, more and more...

... scaling, a need for high performance, cost‐effective packaging technology arises in order to maintain current cost and performance development of microelectronics (ITRS, 2007a). Electronic engineering Films (states of matter) Thermal resistance Thermal conductivity Composite materials ©...

..., rendering the joints mechanically weak. Therefore, a clear need for a new packaging material was identified, particularly one that is expansion matched to GaAs. Composite materials Manufacturing Microwaves Packaging Packaging requirements for microwave applications are much more demanding...