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Keywords: Conductive adhesives
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Journal Articles
Journal:
Microelectronics International
Microelectronics International (1997) 14 (2): 16–21.
Published: 01 August 1997
...M.G. Firmstone; P.M. Bartholomew; G. Paterson; R. Dietz; P. Robinson Conductive adhesive alternatives to tin/lead soldering have mainly concentrated on isotropic silver‐filled epoxy resins. These thermosetting polymers do not offer a universally successful solution and this may be fundamental...
