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Keywords: Conductive layers
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Journal Articles
Journal:
Microelectronics International
Microelectronics International (2001) 18 (2): 11–15.
Published: 01 August 2001
...A. Bochenek; B. Bober; A. Dziedzic; L. Golonka Investigations were aimed at evaluation of assembly properties of conductive layers cofired with LTCC substrates. The usefulness of these layers for low‐temperature soldering, joining with adhesives or for wire bonding was tested. The samples were...
