... to find the key process out of the manufacturing flow; a non‐destructive detaching method and cross section polishing were used to inspect the bond integrity; Auger analysis assisted with argon ion sputter was tried to confirm the contamination; finally the manufacturing processes were redesigned...

...Yap Boon Kar; Noor Azrina Talik; Zaliman Sauli; Foong Chee Seng; Tan Chou Yong; Vithyacharan Retnasamy Purpose This paper aims to discuss the effects of ionic contaminations on the die surface of high lead flip chip ball grid array (FCBGA) package. Ionic contaminations from the flux residue...

... structures and compositions including Fourier transform infrared spectrometer (FTIR), scanning electron microscopy, and energy‐dispersive X‐ray spectroscopy are conducted. Findings The residues on the golden finger are identified to be the flux used in the assembly processes. Besides, the contaminants...

... Festo pneumatic drives reduce contamination from semiconductor processing equipment Keywords Festo, Cleanrooms, Contamination, Semiconductors Festo pneumatic drives have been selected as a cleaner and more compact alternative to conventional electric drives by German semiconductor...