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Foong Chee Seng
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Journal Articles
Ionic contaminations level and cleaning flip chip BGA package via a new cleaning solvent technology
Available to PurchaseYap Boon Kar, Noor Azrina Talik, Zaliman Sauli, Foong Chee Seng, Tan Chou Yong, Vithyacharan Retnasamy
Journal:
Microelectronics International
Microelectronics International (2013) 30 (2): 99–103.
Published: 26 April 2013
