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Keywords: Delamination
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Journal Articles
Journal:
Microelectronics International
Microelectronics International (2001) 18 (3): 20–26.
Published: 01 December 2001
... conditions. © MCB UP Limited 2001 Lead‐free soldering Delamination Crack propagation Moisture Electronic components in an electronic assembly are generally attached to printed circuit boards by lead‐bearing solders. Unfortunately, lead‐bearing solder is toxic, often referred...
Journal Articles
Journal:
Microelectronics International
Microelectronics International (2000) 17 (3): 16–20.
Published: 01 December 2000
... to protect PBGA packages from moisture‐induced failures. As part of the study, PBGA packages with and without conformal coatings were subjected to moisture ingress, moisture desorption and unbiased high temperature high humidity tests. The principal failure mechanisms observed were delamination and cracking...
