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Keywords: Dexter
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Journal Articles
Journal:
Microelectronics International
Microelectronics International (1999) 16 (3)
Published: 01 December 1999
... © MCB UP Limited 1999 --> Dexter Encapsulation Encapsulant materials Dexter introduces Hysol® FluxFill 2000 reflow encapsulant designed for flip chip semiconductor devices Keywords Dexter, Encapsulation, Encapsulant materials Dexter Electronic...
