... and accelerometer fabrication. The paper reports the dicing mechanism for the released MEMS xylophone magnetic sensor fabricated using wafer bonding technology and its characterization in ambient pressure and under vacuum conditions. The purpose of this paper is to dice the wafer bonded Si-magnetometer in a cost...

... © MCB UP Limited 2003 --> Dicing Technology Semiconductors NanoVia announces MultiDice™ wafer dicing technology Keywords: Dicing, Technology, Semiconductors NanoVia, LP has announced the development of an optical beam delivery system specifically tailored...

... © MCB UP Limited 1999 --> Dicing Manufacturing Technology Wafer dicing and singulation system ideal for advanced materials Keywords Dicing, Manufacturing, Technology Manufacturing Technology,Inc. (MTI) manufacturer of high precision, high performance slicing...

... Plate 2K&S Model 984plus dicing system Other options include a high accuracy turntable, high accuracy Z axis, non-contact height sensor and broken blade detector. For further information please contact Henri Van Parys. Tel: +1 215-784-6818 or 2101 Blair Mill Road,Willow...