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1-8 of 8
Keywords: Dies
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Journal Articles
Journal:
Microelectronics International
Microelectronics International (2000) 17 (3)
Published: 01 December 2000
... © MCB UP Limited 2000 --> Semi Dice Dies Semiconductors Surveys Semiconductor manufacturers predict bright future for bare die Keywords Semi Dice, Dies, Semiconductors, Surveys The Fourth Annual Semi Dice, Inc. bare die survey is complete. The survey...
Journal Articles
Journal:
Microelectronics International
Microelectronics International (2000) 17 (3)
Published: 01 December 2000
... position and further extends the value added capability that we offer our customers". Mintech and International Rectifier: new product line agreement Keywords Mintech, International Rectifier, Semiconductors, Dies Mintech have now completed a new product agreement with the power...
Journal Articles
Journal:
Microelectronics International
Microelectronics International (2000) 17 (3)
Published: 01 December 2000
... © MCB UP Limited 2000 --> Quad systems Dies Handling Flip chip 12 Micron, 3 Sigma repeatability now available from Quad; Quad debuts enhanced small die handling option for APS-1 and APS-1H Keywords Quad systems, Dies, Handling, Flip chip Quad Systems...
Journal Articles
Journal:
Microelectronics International
Microelectronics International (2000) 17 (2)
Published: 01 August 2000
... Limited 2000 --> MRSI Dies Eutectic solder Keywords MRSI, Dies, Eutectic solder MRSI has introduced the latest technology for eutectic die attach with the MRSI-505 Assembly Work Cell (Plate 1). This flexible system supports direct gold/silicon eutectic and eutectic reflow using...
Journal Articles
Journal:
Microelectronics International
Microelectronics International (2000) 17 (2)
Published: 01 August 2000
... © MCB UP Limited 2000 --> Semi Dice Surveys Dies Semiconductors Keywords Semi Dice, Surveys, Dies, Semiconductors Semiconductor and circuit manufacturers agree that aerospace/military is still the leading end-use market for bare die, according to the Third Annual...
Journal Articles
Journal:
Microelectronics International
Microelectronics International (1999) 16 (3)
Published: 01 December 1999
... © MCB UP Limited 1999 --> Alphasem Dies Alphasem's new Swissline 9002 FC/CSP die attach system Keywords Alphasem, Dies The new Swissline 9002 FC/CSP die attach system from Alphasem (Plate 2) addresses the market requirements for flip chip, chip scale package...
Journal Articles
Journal:
Microelectronics International
Microelectronics International (1999) 16 (3)
Published: 01 December 1999
... © MCB UP Limited 1999 --> Siemens Dies Placement Siemens introduces direct die feeder technology for fast, easy placement in chip on board (COB) and flip chip applications Keywords Siemens, Dies, Placement Siemens has announced the launch of a new direct die...
Journal Articles
Journal:
Microelectronics International
Microelectronics International (1999) 16 (2)
Published: 01 August 1999
... © MCB UP Limited 1999 --> Dies Semi Dice Semi Dice announces kick-off of third annual bare die survey Keywords Dies, Semi Dice Semi Dice has announced that it recently began conducting the third annual Semi Dice Inc. Bare Die Survey. Designed as a barometer...
