Alphasem's new Swissline 9002 FC/CSP die attach system

Alphasem's new Swissline 9002 FC/CSP die attach system

Keywords Alphasem, Dies

The new Swissline 9002 FC/CSP die attach system from Alphasem (Plate 2) addresses the market requirements for flip chip, chip scale package and µBGA assembly with high throughput (up to 1,700UPH) and maximum cost efficiency. The most important feature is that the complete assembly process, i.e. dispense, die attach and in-line reflow/cure, is performed on a single machine.

Plate 2Swissline 9002 FC/CSP

The system is based on the proven Swissline design and features alignment of die pads or bumps to substrate prior to die attach with a die placement accuracy of ±12 microns. The system also offers an independently controlled pick and bond process.

The SL 9002 FC/CSP,compared to traditionally available equipment, offers 60 per cent lower cost per unit, on less than one third the floor space, by total process control on one system.