... is, for the first time, proven as a promising design for stretchable interconnects, especially for fine pitch applications. Yung‐Yu Hsu can be contacted at: hsu@imec.be © Emerald Group Publishing Limited 2010 Deformation Material‐deforming processes Bonding Films (states of matter) Elastomers...

... and contact pads to the more sophisticated techniques capable of automation wherein moulds are made for epoxy coating or the chip is tightened between contacting parts using elastomer gaskets. Research limitations/implications The emerging packaging technologies have succeeded in making chip packaging...