... a remarkable 6:1 AR without any adhesion problem. The non-invasive front-side manipulation represents a noteworthy improvement and simplification for the design of a multi-step production process. Originality/value An alternative technological approach, called back plate electroplating, has been carried...

... methods of constructing boards onto which electronic components can be assembled are becoming more obvious. In this paper the application of selective electroplating, a technique that has been in use for many years but has not previously been fully exploited, is discussed. It is shown by examining...

... of inductance and Q measured at 30MHz and the self‐resonant frequency (SRF) of each device. The following observations can be made: Electroplating Planar inductor Printed circuit board Thick film For many years, thick‐film, thin film and silicon technologies have allowed...