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Keywords: Encapsulant materials
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Journal Articles
Journal:
Microelectronics International
Microelectronics International (1999) 16 (3)
Published: 01 December 1999
... © MCB UP Limited 1999 --> Dexter Encapsulation Encapsulant materials Dexter introduces Hysol® FluxFill 2000 reflow encapsulant designed for flip chip semiconductor devices Keywords Dexter, Encapsulation, Encapsulant materials Dexter Electronic...
Journal Articles
Journal:
Microelectronics International
Microelectronics International (1999) 16 (3)
Published: 01 December 1999
... NPL improves reliability and performance of microelectronics encapsulants Keywords NPL, Encapsulant materials NPL is developing measurement methods for quantifying the protective behaviour of microelectronic encapsulant materials, enabling the industry to improve the reliability...
