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Journal Articles
Microelectronics International (2000) 17 (3)
Published: 01 December 2000
... © MCB UP Limited 2000 --> Loctite Epoxy Loctite introduces thermal shock resistant epoxy potting compound Keywords Loctite, Epoxy Loctite Corporation has introduced a new medium viscosity, thermally conductive epoxy potting compound, Loctite 3862, for electronic...
Journal Articles
Microelectronics International (1997) 14 (3): 12–14(continued on page 18).
Published: 01 December 1997
...R. Ghoshal; M. Sambasivam; P.K. Mukerji Novel epoxy formulations have been developed for microelectronic packaging applications. The resin compositions are based on cycloaliphatic esters and proprietary epoxies, which possess excellent thermal and electrical stability. The key features...

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