... in MFeIS structure with one order reduction in the leakage current density. The same MFeS device was found having excellent fatigue resistance property for greater than 1010 read/write cycles and data retention time more than 3 h. Originality/value The MFeIS structure has been fabricated with constant...

...A.J. Curley; K.J. Williams; T. Le; H. Patel This paper describes failure load analysis to predict the number of fatigue cycles required to cause adhesion failure at the thick film conductor and alumina substrate interface in ball grid array packages (BGAs). This enables prediction of the number...

... thermal fatigue reliability for the solder joints in this structure. A parameterised non‐linear finite element model is used to calculate the inelastic strains induced in the solder joints due to thermal cycling. The techniques of design of experiments (DOE) and response surface modelling (RSM) enhance...

..., transformations between test and field conditions are still not completely known. For new types of array components,the answers critically depend upon ‘Component age’ and change in fatigue mechanisms. The increasing complexity of microelectronic assemblies and the hidden joints of BGAs lead to an increase...