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1-3 of 3
Keywords: Fatigue life
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Journal Articles
Effects of interface cracks on reliability of surface mount technology interconnection in service environment
Available to PurchaseShaoyi Liu, Songjie Yao, Song Xue, Benben Wang, Hui Jin, Chenghui Pan, Yinwei Zhang, Yijiang Zhou, Rui Zeng, Lihao Ping, Zhixian Min, Daxing Zhang, Congsi Wang
Journal:
Microelectronics International
Microelectronics International (2023) 40 (2): 140–151.
Published: 12 January 2023
... is to reveal the effects of interface cracks on the fatigue life of SMT solder joint under service load and to provide some valuable reference information for improving service reliability of SMT packages. Design/methodology/approach A 3D geometric model of SMT package is established. The mechanical...
Journal Articles
Thermal performance and fatigue life prediction of POP stacked chip assembly under thermal cycling load
Available to Purchase
Journal:
Microelectronics International
Microelectronics International (2020) 37 (4): 165–171.
Published: 03 September 2020
...Dongbo Li; Jianpei Wang; Bing Yang; Yongle Hu; Ping Yang Purpose This paper aims to perform experimental test on fatigue characteristics of package on package (POP) stacked chip assembly under thermal cycling load. Some suggestions for design to prolong fatigue life of POP stacked chip assembly...
Journal Articles
Dynamic reliability approach of chip scale package assembly under vibration environment
Available to Purchase
Journal:
Microelectronics International
Microelectronics International (2014) 31 (2): 71–77.
Published: 29 April 2014
...Ping Yang; Xiusheng Tang; Yu Liu; Shuting Wang; Jianming Yang Purpose – The purpose of this paper is to perform experimental tests on fatigue characteristics of chip scale package (CSP) assembly under vibration. Some suggestions for design to prolong fatigue life of CSP assembly are provided...
