... only Piezoelectric micromachined ultrasonic transducer (PMUT) Micro-electromechanical systems (MEMS) Bimorph thin film Cantilever beam structure Finite element method Transmission performance Semiconductor technology thick/thin film sensors Natural Science Project of the Henan...

... using the finite element method. The effects of different IMC layer thicknesses on the ability of solder joints to withstand thermal fatigue and life prediction are derived. The ability of solder joints to resist thermal fatigue for different solder compositions is also learned. The research...

... Emerald Publishing Limited Licensed re-use rights only Finite element method Mechanical properties Response surface method Modal testing Electronic devices are prone to expose to a vibrational environment during their service life (Steinberg, 2000). As composite material is extensively...

... to crack issues. This paper aims to study the strength of thin FOWLP because the low package strength may lead to the reliability issue of package crack. Design/methodology/approach This paper uses the experimental method (three-point bending test) and finite element method (ANSYS simulation software...

... bonding and its relation to the materials used will be demonstrated. Adhesion Finite element method Lift‐off Thermodynamics Wire bonding © MCB UP Limited 1998 The temperature signal in Figure 3 is calculated for a 180ms welding process with the assumption that the US power acts...