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Keywords: Fluid structure interaction
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Journal Articles
Journal:
Microelectronics International
Microelectronics International (2021) 38 (2): 33–45.
Published: 26 February 2021
... scheme and fluid-structure interaction (FSI) setup. Figure 2 Schematic diagram of multi-stack flip-chip underfilling boundary conditions Figure 3 summarized the general process flow of underfill encapsulation for multi-stack BGA flip chip. BGA chip undergoes flux dispensing, alignment...
