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Keywords: Heat dissipation
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Journal Articles
Journal:
Microelectronics International
Microelectronics International (2023) 40 (1): 26–34.
Published: 15 July 2022
... or design that can withstand and perform well in terms of Rth and heat dissipation during operation. SolidWorks 2017 and AutoCAD Mechanical 2017 software were used to publish all thoughts and ideas, including the size dimensions (x, y and z) and material choices for each package. Design/methodology...
Journal Articles
Journal:
Microelectronics International
Microelectronics International (1996) 13 (2): 54–56.
Published: 01 August 1996
... or Al2O3) has a substantial influence on the possible heat dissipation (LTCC= low temperature cofired ceramic). Multilayers Ceramic ball grid array Heat Dissipation Microelectronics The Thermax™ simulation program, which can be coupled to the design, is used to simulate the heat...
