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Keywords: ICP-RIE
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Journal Articles
Journal:
Microelectronics International
Microelectronics International (2014) 31 (2): 78–85.
Published: 29 April 2014
... between 3 μm-5 μm were obtained, Oxygen plasma spreen was used to reduce the size of the PR to 800 μm, after this, the wafer with 800 μm was loaded into SAMCO inductively coupled plasma (ICP)-RIE and got silicoon microwire was obtained. Next, the sample was put into an oxidation furnace for 15, 30, 45...
