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Keywords: IMCs
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Journal Articles
Guisheng Gan, Hao Yang, Jie Luo, Yongchong Ma, Jiajun Zhang, Xin Liu, Qiao He, Leqi Li, Dayong Cheng
Journal:
Microelectronics International
Microelectronics International (2025) 42 (1): 1–14.
Published: 27 January 2025
... and the Al substrate, an Al-Sn-Zn solid solution was generated, which gradually increased with extended aging time. Figure 4 presents the IMCs of Cu/SACZ/Al joints at the Cu-side after aging for durations of 0, 6, 48 and 96 h at a temperature of 150°C. It was observed that the solder exhibited good...
