... Inspection New IC wafer fault elimination system Keywords: Inspection Envisage Systems the makers of the CAPVIS visual inspection system, have launched a new, low cost wafer inspection system, which enables electronic component manufacturers producing ceramic or silicon...

...Z.W. Zhong; Y. Jiang When engineers choose and arrange proper lighting sources for an inspection system, many of them rely on their own experience or guesswork without any guidance of theories. This paper discusses the efficient perception technique, i.e. the Torrance‐Sparrow model and its...

... © MCB UP Limited 2002 --> Solder Inspection Cyberoptics KS 75: Post-reflow solder joint inspection with inherently low false calls Keywords: Solder, Inspection, Cyberoptics CyberOptics has introduced the KS 75 AOI (automated optical inspection)system for solder...

...:+43-5337-600-695; E-mail: monika.waicher@datacon.at © MCB UP Limited 2000 --> Datacon Electronic packaging Inspection Solder bumps Keywords Datacon, Electronic packaging, Inspection, Solder bumps The market for advanced packaging - including advanced packaging...

... Total solutions for the back end from datacon Keywords: Datacon, Inspection The new 3D inspection system 8000 enables the analysis of three-dimensional image data for bump, wire, wafer and post-bonding inspections as well as the inspection of glue and solder pastes...

... die processing. The basic INS 1000 station still maintains all of the flexible optical inspection techniques available on the standard INS 1000, including UV imaging for high resolution wafer inspection. For further information please contact Molly Lundberg, Director, Communications. Tel: +1 847...

... © MCB UP Limited 1999 --> MicroJoin Bonding Inspection MicroJoin introduces the 4200 PDI pulsed heat hot bar bonder with powered display inspection Keywords MicroJoin, Bonding, Inspection MicroJoin, Inc., a subsidiary of Palomar Technologies, Inc., introduces...

... CyberOptics introduces Vantage, the latest addition to the company's line of CyberScan® inspection systems (Plate 3). Vantage is well-suited to thick film inspection because non-contact technology makes it possible to measure film deposits at the critical wet stage, when defective circuits can...