Update search
Filter
- All
- Title
- Author
- Author Affiliations
- Full Text
- Abstract
- Keyword
- DOI
- ISBN
- EISBN
- ISSN
- EISSN
- Issue
- Volume
- References
Filter
- All
- Title
- Author
- Author Affiliations
- Full Text
- Abstract
- Keyword
- DOI
- ISBN
- EISBN
- ISSN
- EISSN
- Issue
- Volume
- References
Filter
- All
- Title
- Author
- Author Affiliations
- Full Text
- Abstract
- Keyword
- DOI
- ISBN
- EISBN
- ISSN
- EISSN
- Issue
- Volume
- References
Filter
- All
- Title
- Author
- Author Affiliations
- Full Text
- Abstract
- Keyword
- DOI
- ISBN
- EISBN
- ISSN
- EISSN
- Issue
- Volume
- References
Filter
- All
- Title
- Author
- Author Affiliations
- Full Text
- Abstract
- Keyword
- DOI
- ISBN
- EISBN
- ISSN
- EISSN
- Issue
- Volume
- References
Filter
- All
- Title
- Author
- Author Affiliations
- Full Text
- Abstract
- Keyword
- DOI
- ISBN
- EISBN
- ISSN
- EISSN
- Issue
- Volume
- References
NARROW
Format
Journal
Type
Issue Section
Date
Availability
1-8 of 8
Keywords: Inspection
Close
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
Sort by
Journal Articles
Journal:
Microelectronics International
Microelectronics International (2006) 23 (1)
Published: 01 January 2006
... © Emerald Group Publishing Limited 2006 --> Inspection New IC wafer fault elimination system Keywords: Inspection Envisage Systems the makers of the CAPVIS visual inspection system, have launched a new, low cost wafer inspection system, which enables electronic...
Journal Articles
Inspection of electronics packages using the efficient perception technique
Available to Purchase
Journal:
Microelectronics International
Microelectronics International (2004) 21 (2): 41–44.
Published: 01 August 2004
...Z.W. Zhong; Y. Jiang When engineers choose and arrange proper lighting sources for an inspection system, many of them rely on their own experience or guesswork without any guidance of theories. This paper discusses the efficient perception technique, i.e. the Torrance‐Sparrow model and its...
Journal Articles
Journal:
Microelectronics International
Microelectronics International (2002) 19 (2)
Published: 01 August 2002
... KS 75: Post-reflow solder joint inspection with inherently low false calls Keywords: Solder, Inspection, Cyberoptics CyberOptics has introduced the KS 75 AOI (automated optical inspection)system for solder joint inspection and component defect detection. KS 75 uses high-resolution...
Journal Articles
Journal:
Microelectronics International
Microelectronics International (2000) 17 (2)
Published: 01 August 2000
... and quality assurance in the production of bumped wafers. Datacon's new 8000is 3D inspection system, with its high accuracy and reliability combined with very high throughput, is ideal for this type of automated application. The 8000is analyzes the three-dimensional images used in bump, wire, wafer...
Journal Articles
Journal:
Microelectronics International
Microelectronics International (2000) 17 (1)
Published: 01 April 2000
... © MCB UP Limited 2000 --> Datacon Inspection Total solutions for the back end from datacon Keywords: Datacon, Inspection The new 3D inspection system 8000 enables the analysis of three-dimensional image data for bump, wire, wafer and post-bonding inspections...
Journal Articles
Journal:
Microelectronics International
Microelectronics International (1999) 16 (3)
Published: 01 December 1999
... © MCB UP Limited 1999 --> MicroJoin Bonding Inspection MicroJoin introduces the 4200 PDI pulsed heat hot bar bonder with powered display inspection Keywords MicroJoin, Bonding, Inspection MicroJoin, Inc., a subsidiary of Palomar Technologies, Inc., introduces...
Journal Articles
Journal:
Microelectronics International
Microelectronics International (1999) 16 (3)
Published: 01 December 1999
... New Leica INS 1000 post-electrical test inspection station Keywords Leica, Inspection The new Leica INS 1000 post-electrical test inspection station (PETIS) is an enhanced system for the inspection of whole wafers after electrical testing. The PETIS system allows the direct...
Journal Articles
Journal:
Microelectronics International
Microelectronics International (1999) 16 (1)
Published: 01 April 1999
... © MCB UP Limited 1999 --> CyberOptics Inspection Thick film Vantage™ produces 3D scans of thick film Keywords CyberOptics, Inspection, Thick film CyberOptics introduces Vantage, the latest addition to the company's line of CyberScan® inspection systems (Plate 3...
