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Keywords: Intermetallic
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Journal Articles
Journal:
Microelectronics International
Microelectronics International (2014) 31 (2): 61–70.
Published: 29 April 2014
... model features a TSV/micro-bump bonding structure connecting two adjacent silicon (Si) chips, with and without an underfill layer between. A case that the entire solder layer has transformed into an intermetallic layer is also considered. Findings – The existence of an underfill layer enhances...
