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Keywords: Load analysis
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Journal Articles
Journal:
Microelectronics International
Microelectronics International (1999) 16 (3): 43–45.
Published: 01 December 1999
...A.J. Curley; K.J. Williams; T. Le; H. Patel This paper describes failure load analysis to predict the number of fatigue cycles required to cause adhesion failure at the thick film conductor and alumina substrate interface in ball grid array packages (BGAs). This enables prediction of the number...
