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Keywords: Lognormal plot
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Journal Articles
Journal:
Microelectronics International
Microelectronics International (2013) 30 (3): 169–175.
Published: 26 July 2013
... grid array (FBGA) package with Cu and Au wire bonds was assembled with green molding compound and substrate. Samples are subjected for long‐term high temperature storage bake test at elevated temperatures of 150°C, 175°C and 200°C. Long‐term reliability plots (lognormal plots) are established...
