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Journal Articles
Journal Articles
Journal Articles
Journal Articles
Microelectronics International (2015) 32 (2): 63–72.
Published: 05 May 2015
...Mingzhi Dong; Fabio Santagata; Robert Sokolovskij; Jia Wei; Cadmus Yuan; Guoqi Zhang Purpose – This study aims to provide a flexible and cost-effective solution of 3D heterogeneous integration for applications such as micro-electro-mechanical system (MEMS) applications and smart sensor systems...
Journal Articles
Microelectronics International (2009) 26 (3): 9–21.
Published: 31 July 2009
... Printed circuits MEMS In terms of commercial sensor systems, there are a large number of six‐DOF commercial wireless inertial sensors on the market: a 2.45 GHz wireless inertial measurement unit (WIMU) is available from Microstrain Microminiature Sensors (2008) with a size of 58×43×26 mm...
Journal Articles
Microelectronics International (2007) 24 (3): 27–33.
Published: 31 July 2007
... infra‐red laser ablation. Originality/value The laser ablation of LTCC by optical fibre sources is discussed. © Emerald Group Publishing Limited 2007 MEMS Electronic equipment and components Ceramics With the development of MEMS technology, miniaturisation technology is rapidly...
Journal Articles
Microelectronics International (2003) 20 (2)
Published: 01 August 2003
... © MCB UP Limited 2003 --> MEMS Packaging Newport announces advanced automation for MEMS packaging Keywords: MEMS, Packaging Newport Corporation has announced the availability of advanced tools for automating the manufacturing of micro-electro-mechanical systems...
Journal Articles
Microelectronics International (2002) 19 (3)
Published: 01 December 2002
... © MCB UP Limited 2002 --> MEMS Standards Keywords: MEMS, Standards This month, executives from leading micro- electromechanical systems (MEMS)companies and institutes met at SUSS MicroTec in Garching, Germany, to define standards for international MEMS practice...
Journal Articles
Microelectronics International (2002) 19 (1)
Published: 01 April 2002
... --> Coatings MEMS Keywords: Coatings, MEMS Recent MEMS applications demand completely tension-free PECVD coatings of silicon nitride, silicon oxynitride and silicon carbide films with special thicknesses. For sensors, free-standing structures are fabricated by initially depositing a layer...

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