...Krzysztof Górecki; Paweł Górecki Purpose The purpose of this paper is to propose a simple electrothermal model of GaN Schottky diodes, and its usefulness for circuit-level electrothermal simulation of laboratory-made devices is proved. Design/methodology/approach The compact electrothermal...

...Krzysztof Górecki; Paweł Górecki Purpose This paper aims to propose the electrothermal dynamic model of the insulated gate bipolar transistors (IGBT) for SPICE. Design/methodology/approach The electrothermal model of this device (IGBT), which takes into account both electrical and thermal...

...Dejan V. Tošić; Marija F. Hribšek Purpose The purpose of this paper is to model multilayer structure surface acoustic wave (SAW) sensors, incorporated in CMOS or micro‐electro‐mechanical system integrated circuits, and to derive the corresponding wave velocity as an analytic expression in terms...

... between the experimental results and simulation can illustrate the validity of the experimental test and finite element modeling each other. Findings The modal distribution test shows the influence of structure characteristics, materials parameters and fixed‐modes of PBGA assembly board. The changing...

.... The purpose of this paper is to propose an RC thermal model of the dynamic electro‐thermal behavior of IGBT pulse width modulation inverter modules. Design/methodology/approach The electrothermal model has been implemented and simulated with a MATLAB simulator and takes into account the thermal influence...

..., which normally follow the radio frequency circuit synthesis. Originality/value It this paper, a new adaptation test fixture in PCB technology is realized. It is modeled and it has provided the extraction of parameters (intrinsic and extrinsic) of SMD inductor with great accuracy. Low value SMD...

...F. Mohammadi; M. Marami Purpose The purpose of this paper is to develop a dynamic compact thermal model (DCTM) of electronic packages. This model is a necessary tool for rapid thermal analysis of the systems which we exposed to boundary condition variation and/or power switching mode...

... computational models used to investigate the thermal and thermo‐mechanical issues arising during the operation of such electronic modules. In particular, a two‐shot overmoulded structure comprising an inner layer of water soluble and an outer layer of conventional engineering thermoplastics was investigated...

... out using this work. Research limitations/implications The predictive model does not consider the variation in load capacitance of each cell. Practical implications At present, a prime requirement in application specific integrated circuit design is reduction in design cycle time. As a result...