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Keywords: On-package integration
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Journal Articles
Journal:
Microelectronics International
Microelectronics International 1–8.
Published: 25 December 2025
... system on chip (SoC) and LPDDR5X on-package integration design only using 3 RDL on the WL package. This paper aims to examine the influence to explore the trace routing scheme and corresponding signal integrity ( SI ) performance of the RDL interconnection for the on-package LPDDR5X, thereby...
