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Keywords: Package on package system
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Journal Articles
Journal:
Microelectronics International
Microelectronics International (2020) 37 (4): 165–171.
Published: 03 September 2020
... 15 01 2020 18 01 2020 03 02 2020 10 02 2020 16 02 2020 17 02 2020 © Emerald Publishing Limited 2020 Emerald Publishing Limited Licensed re-use rights only Fatigue life Package on package system Stress/strain Thermal cycling load The fatigue life...
